- Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.en.wikipedia.org/wiki/Integrated_circuit_packaging
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Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The … See more
Electrical
The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. … See moreFor traditional ICs, after wafer dicing, the die is picked from the diced wafer using a vacuum tip or suction cup and undergoes die attachment … See more
Early integrated circuits were packaged in ceramic flat packs, which the military used for many years for their reliability and small size. The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package … See more
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