GD-883K【グローバルデスク（W800×D800mm）】ミニタワー …
WEBGD-883K【グローバルデスク（W800×D800mm）】ミニタワーパソコン+周辺機器設置に最適な、W800の2段式タイプ。
MIL-STD-883 K MICROCIRCUITS - EverySpec
WEBMIL-STD-883K, DEPARTMENT OF DEFENSE TEST METHOD STANDARD: MICROCIRCUITS (25-APR-2016)., This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine …
WEBFOREWORD. This standard is approved for use by all Departments and Agencies of the Department of Defense. This issue of MIL–STD–883 series establishes uniform test methods for testing the environmental, physical, and electrical characteristics semiconductor devices. This entire test method standard has been revised.
WEBThe purpose of this test is to assess the structural quality of deposited dielectric films (e.g., CVD, sputtered or electron beam evaporated glass or nitride, etc.) over aluminum metallized semiconductor devices or microcircuits. The test is directed at identifying process and materials related glass layer defects which result in localized ...
New Version of MIL-STD-883 • GD4 Test Services
WEBMIL-STD-883 set the standards for tests for microelectronic devices suitable for use within Military and Aerospace electronic systems. It includes basic test processes to determine resistance to the harmful effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; and manufacturing ...
WEBThe implied leak rate that is measured on the detector for a given package using the specified conditions and employing a specified test medium (tracer gas) specific to that detector. Measured leak rate is expressed in units of atmosphere cubic centimeters per second (atm cm3/s) for the medium used.
WEB1. PURPOSE. This method provides a means of judging the quality and acceptability of device interconnect metallization on non-planar oxide integrated circuit wafers or dice. SEM inspection is not required on planar oxide interconnect technology such as chemical mechanical polish (CMP) processes.
WEB1. PURPOSE. The purpose of this test is to check the internal materials, construction, and workmanship of microcircuits for compliance with the requirements of the applicable acquisition document.
WEBBurn-in shall be 320 hours minimum for class level S hybrids (class K). The device should be burned in at the maximum specified operating temperature, voltage, and loading conditions as specified in the device specification or drawing.
MIL-STD-883 K CHG-2 K MICROCIRCUITS - EverySpec
WEBMIL-STD-883K (W/ CHANGE-2), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: MICROCIRCUITS (22-FEB-2017)., his standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to …